TAIPEI, Taiwan, February 24, 2023 — ASUS today announced that it is showcasing its leading HPC data-center solutions, as well as advanced technologies and innovations developed in cooperation with industry-leading partners, at Supercomputing Asia (SCA) 2023 — from February 27 to March 2, 2023 at Singapore Expo Convention & Exhibition Centre. The ASUS booth is number D03, located on Level 2 of the Max Atria.
ASUS has invited leading industry experts on AI and cloud technologies to share their insights, including Andy Hwang, Vice President of Taiwan Web Service Corporation (TWS), who will be sharing his thoughts during an industry plenary on leveraging the benefits of AI-focused HPC to accelerate research and development of foundation models. John Chen, Director of PTC System(s) Pte Ltd, will also be offering his insights on building next-generation HPC and AI clusters with NVIDIA, and Jane Shen Shengmei, Chief Scientist, Pensees Systems Pte Ltd, will share AI for video analytics and its applications and architecture.
Sustainable design for HPC data centers
Leveraging innovative ASUS thermal design, ASUS rack server solutions empower enhanced system airflow — minimizing power consumption and maximizing efficiency. The lower power consumption aligns with the ASUS 2025 Sustainability Goals initiative, which aims to bring about proactive and positive change. Specifically, the new hard-drive tray design on the front panel of ASUS RS-series servers features ventilation holes that are 44% wider compared to the previous generation, increasing airflow through the system and improving thermal efficiency. This adds to component longevity, with features that include the latest DDR5, PCIe® 5.0 and NVMe® technologies. The improved fan-tunnel design, with independent CPU- and GPU-airflow tunnels, increases the capabilities of 400 W CPUs and 350 W GPUs — significantly boosting compute-intensive enterprise workloads.
Comprehensive liquid-cooling solutions
Increased power consumption, higher CPU TDP and ever-more-powerful GPUs present challenges for server markets and data-center operators. The latest ASUS RS720QA-E12 high-density server, cooled via direct-to-chip (D2C) technology, stands out from the competition to deliver over 90%-lower fan power consumption and over 29.6%-lower noise levels — empowered by ASUS Thermal Radar 2.0 and Power Balancer technologies. ASUS is also working with industry-leading immersion-cooling partner, Submer and MGC, to deliver comprehensive liquid-cooling solutions — from servers to liquid-cooling modules, data-center floor plans, capability evaluations and suggested infrastructure.
Harness the power of the NVIDIA HGX H100 8-GPU
Utilizing the NVIDIA HGX platform, the all-new ASUS ESC N8-E11 supports the NVIDIA HGX H100 8-GPU and NVSwitch design, making it an ideal choice for large-scale AI training and HPC infrastructure. ESC N8-E11 is powered by dual-socket 4th Gen Intel® Xeon® scalable processors and offers comprehensive and effortless IT management with ASUS Control Center.
