Transform your data center TCO with the high-density server powered by 3rd Gen Intel® Xeon® Scalable processors. With an innovative design that fits four nodes in a 2U chassis, RS720Q-E10-RS8U accommodates dual-socket CPUs, PCIe 4.0 and OCP 3.0 expansions to satisfy the increasing demands for efficiency, density and TCO-optimization for data centers, web servers, virtualization, cloud and hyperscale environments.

Each
node
supports

High CPU
Performance

2 sockets

PCIe 4.0
Expansion

1 slot

DDR4 3200
 

16 DIMM

NVMe Drive
 

2 bays

M.2 Storage
 

2 slots

3rd Gen Intel® Xeon® Scalable Processors

The latest 3rd Gen Intel® Xeon® Scalable Processors feature core counts from 8 to 40 cores and an array of frequency and power supports, and deliver up to 40% better performance compared to the previous generations. With built-in security features, this new platform delivers outstanding performance in security including encryption, authentication and data integrity across the breadth of standards that are prevalent in networking, enterprise and the cloud.

Up to

1.5X

General compute
performance gain

Up to

64lanes

PCI Express 4 (per socket)

 

40cores

Up to 1.42X more cores

Intel Xeon Scalable CPU family
Product Layout Overview
Panels
Node
Front Panel
front panel layout front panel layout front panel layout

18 x 2.5" Hot-swap Storage Bays
(8 x SATA/SAS/NVMe supported)



Rear Panel
Rear panel layout Rear panel layout Rear panel layout

1 1 x OCP 3.0 (Gen4 x16 link)

2 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

3 1 x OCP 3.0 (Gen4 x16 link)

4 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

5 1 x OCP 3.0 (Gen4 x16 link)

6 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

7 1 x OCP 3.0 (Gen4 x16 link)

8 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

One node layout One node layout One node layout

1 1 x PCIe x16 slot, LP, HL
(Gen4 x16 link)

2 16 x DDR4 3200/2933
RDIMM/LR-DIMM/LR-DIMM 3DS

3 1 x OCP 3.0 (Gen4 x16 link) , optional

4 Dual 3rd Gen Intel® Xeon® Scalable Processors*

5 2 x M.2

*The TDP under 250W is set to be used air cooling. The TDP more than 205W is recommended on liquid cooling

Enhanced Security

ASUS RS720Q-E10 servers integrate PFR FPGA as the platform Root-of-Trust solution for firmware resiliency to prevent from hackers from gaining access to infrastructure. ASUS security solutions are fully compliant with the 2018 National Institute of Standards and Technology (NIST) SP 800 193 specification.

In addition, all RS720Q-E10 servers also include support Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.

The TPM-M and TPM SPI difference and supported product list

* Platform Firmware Resilience (PFR) module must be specified at time of purchase and is factory-fitted. It is not for sale separately.

Enhanced security
OCP 3.0

ASUS RS720Q-E10 servers feature the latest OCP NIC 3.0 card with PCIe 4.0 bandwidth for a faster time-to-market network solution, delivering the speeds of up to 200 Gbps for high bandwidth and low latency. It also features a tool-less, hot-swappable design to simplify installation and serviceability.

OCP 3.0 ready
Server-management Solution
ASUS ASMB10-iKVM
ASUS Control Center
ASUS ASMB10-iKVM

ASUS ASMB10-iKVM is the latest server-management solution from ASUS, built upon the ASPEED 2600 chipset running on the latest AMI MegaRAC SP-X. The module provides various interfaces to enable out-of-band server management through WebGUI, Intelligent Platform Management Interface (IPMI) and Redfish® API.


Learn more about ASUS ASMB10-iKVM

BMC boot time comparison chart
ASUS Control Center

ASUS Control Center (ACC) is a centralized and integrated IT-management platform for monitoring and controlling ASUS servers, workstations and mini PCs. ACC enables remote BIOS updates, monitoring of multiple systems via mobile devices, and one-click software updates and dispatching, allowing easier server management for any IT infrastructure.


Learn more about ASUS Control Center

ASUS Control Center